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  • ¡]2007¦~12¤ë11¤é-¤¤¥¡ªÀ¡^®Ú¾Ú¥~¹q³ø¾É¡A¬ü°ê«Ê¸Ë¼tTessera¤w¦V¼w¦{ªF°Ï¦a¤èªk°|¤Î¬ü°ê°ê»Ú¶T©ö©e­û·| (ITC)±±§i«n¬ì (2408)¤Î­Z¼w (5387)µ¥¤½¥q«I¥Ç±M§QÅv¡C¹ï¦¹¡A«n¬ì»P­Z¼w¤@­Pªí¥Ü¡A¤½¥q¥Ø«e¥¿¤F¸Ñ¤¤¡C
  • ¡]2007¦~12¤ë7¤é-CNET¬ì§Þ¸ê°Tºô¡^IBM«ü±±µØºÓ«I¥Ç±M§Q¡A­n¨D¬ü¬F©²«Ê±þ¨ä²£«~¡C12¤ë7¤é°ê»Ú³ø¾É IBM­n¨D¬ü°ê¬F©²«Ê±þ¶i¤fµØºÓ¥Í²£ªº¤@¨Ç¹q¸£²£«~¡A«ü±±¨ä«I¥Ç¤FIBM 3¶µ±M§Q¡C

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®Ú¾Ú¤W­z¤G·s»D»P¬ÛÃöºô¸ô³ø¾É¡A·J¾ãª§Ä³±M§Q¦pªí¤@©Ò¥Ü¡C³o¨â­Ó¨å«¬±M§Q«IÅv¶D³^®×¡A¦A¦¸»¡©ú§Þ³N»â¥ý°ê®a»P¥ø·~¡A«ùÄò¡B¼ô½m»P¦³¨t²Îªº¨Ï¥Î¡u¾i¡B®M¡B±þ¡vÉ«­Ç¡A°w¹ï§Þ³N¸¨«á°ê®a»P¥ø·~ªº±Ò°Ê±M§Q¾Ôª§¡C®Ú¾Ú·s»D³ø¾É¡ATessera­Y¶¶§Q¦¬¨ì°O¾ÐÅé¼t°ÓÅv§Qª÷¡A«h¬ÛÃö¤½¥q²£«~¤ò§Q²v¬ù¤U­°10%¡C

¬°¶i¦æ¬ü°ê«IÅv¶D³^±¡³ø°lÂÜ¡A·J¾ã¬ÛÃö¸ê°Tºô¯¸»P¸ê®Æ®w¦p¹Ï¤@¡B¤G¡B¤T©Ò¥Ü¡AŪªÌ¥i¶i¤@¨B¦Û¦æ¬d¾\»P¤F¸Ñ¡CÃö©ó¨â«IÅv®×¨ä¥L¸ê°T»P³ø¾É¨£¤å¥½¬ÛÃö³sµ²³Ì«á¡A±M§Q¶D³^¾Ôª§Àþ®§¸U¤Æ¡A¤@­Ó¨}¦n´¼°]ºÊ±±Åé¨t¥[¤W²M´·µ¦²¤ÅÞ¿è¤~¬O¥ø·~ªø»·¸gÀ礧¹D¡C

ªí¤@¡BTessera»PIBMª§Ä³±M§Q¤@Äýªí

­ì§i

³Q§i

«IÅv²£«~

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Tessera Technologies, Inc.

A-DATA Technology Co.¡]«Â­è¡^, Ltd., Acer Inc.¡]§»ùÖ¡^, Acer America Corp., Centon Electronics, Inc., Elpida Memory, Inc., International Products Sourcing Group, Kingston Technology Co.¡]¬ü°êª÷¤h¹y¡^, Nanya Technology Corporation¡]«n¬ì¡^, Peripheral Device and Product Systems, Inc., Powerchip Semiconductor Corp.¡]¤O´¹¡^, ProMOS Technologies Inc.¡]­Z¼w¡^, Ramaxel Technology Ltd., SMART Modular Technologies¡]¬ü°ê¥@ÁÚ¡^, Inc., and TwinMOS Technologies Inc.¡]¶Ô­Z¡^

small-format BGA semiconductor packages and products that include these packages.

certain DRAM memory chips, DRAM memory modules and computer systems incorporating such chips and modules.

1. US5,679,977
[¥þ¤å¤U¸ü];

2. US6,133,627
[¥þ¤å¤U¸ü];

3. US5,663,106
[¥þ¤å¤U¸ü];

4. US6,458,681
[¥þ¤å¤U¸ü].

International Business Machines Corporation

ASUSTek Computer, Inc.¡]µØºÓ¡^

power, cooling and clustering technology

1. US5,008,829
[¥þ¤å¤U¸ü];

2. US5,249,741
[¥þ¤å¤U¸ü];

3. US5,371,852
[¥þ¤å¤U¸ü].

Source: ¬ì§Þ¬Fµ¦¬ã¨s»P¸ê°T¤¤¤ß, STPI, 2007/12.

(810¦r¡Fªí1¡F¹Ï3)

(¬ì§Þ²£·~¸ê°T«Ç-- David ½s¼¶¡A2007/12/13)

ÃöÁä¦r¡G Tessera¡BIBM¡B±M§Q«IÅv¶D³^¡B±M§QºÊ±±

°Ñ¦Ò¸ê®Æ¡G

  • http://magazine.sina.com.tw/cnglobalviews/200604/2006-04-13/20107369.shtml
  • http://dockets.justia.com/
  • http://www.law360.com/search.aspx
  • http://info.usitc.gov/sec/dockets.nsf/337?OpenView
  • http://assignments.uspto.gov/assignments/?db=pat
  • http://www.computerweekly.com/Articles/2007/12/10/228536/ibm-starts-patent-dispute-over-power-cooling-and-clustering.htm

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2007/08/20
¥úÄ_ÀÀ¦¬ÁʪâÄõPerlos¡A±q±M§QÆ[ÂI¬Ý¤â¾÷¹s²Õ¥óÄvª§
2007/08/14
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¹Ï¤@¡BJustiaºô¯¸¡]http://dockets.justia.com/¡^
 
¹Ï¤G¡BLaw360ºô¯¸¡]http://www.law360.com/search.aspx¡^
 
¹Ï¤T¡B¬ü°êITC 337¸ê®Æ®w¡]http://info.usitc.gov/sec/dockets.nsf/337?OpenView¡^
 

 

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